PCBA 归档 - SENLIAN

Assembly Service The PCBs above need assembly

Other Parameters (Fill in to get the exact price, or leave it blank to wait for final quote.) More

They can be left blank if you're not sure about the number of Unique Parts, SMT Parts, BGA/QFP Parts or THT parts.

Customized Services and Advanced Options More

Below options, their cost is not included in the online quotation

Depanel the boards to delivery:
No Yes
Function test:
No Yes
Conformal coating:
No Yes
Firmware loading:
No Yes
Press-fit assembly:
No Yes
Box build assembly:
No Yes
Cable wire harness
assembly:
No Yes
Custom packaging:
No Yes
Number of X-ray test:

PCB Specification Selection

PCB Specification Selection

PCB file (optional):

Board type :

Panel requirements:

Route Process:

Different design in panel :

* Size (single):

* Quantity (single):

Layers:

Copper layer:

Material:

Rogers:

Thermal conductivity:

Thermoelectricseparation:

Structure of MCPCB:

FR4-TG:

Thickness:

Thickness:

Thickness:

Min track/spacing:

Min hole size:

Solder mask:

Silkscreen:

Edge connector:

Thickness of Immersion Gold:

Au/Ni thickness:

Thickness of ENEPIG:

Surface finish:

Thickness of ENEPIG:

Au/Ni thickness:

Thickness of Immersion Gold:

Thickness of Immersion gold:

Thickness of Hard gold:

Immersion gold / Hard gold thickness:

Via process:

Finished copper:

Inner Copper:

Remove product No. :

Other special request:

SMD-Stencil Order together with PCB

Stencil type:

Multi-level/Step stencil:

Size (mm) :

Stencil side:

Quantity:

Thickness:

Existing fiducials:

Electropolishing:

Other Special request:

Assembly Service The PCBs above need assembly

3 flexible options:

Board type :

Assembly side(s):

* Quantity:

* Pay attention:

Number ofUnique Parts:

Number of SMD Parts:

Number of BGA/QFP Parts:

Number of Through-Hole Parts:

Detailed information of assembly:

Pricing And Build Time Price Comparison Matrix

Standard PCB RFQ

*Name:

*Email:

Tel:

Company:

Country:

Address:

Comments:

PCB file:

Different design
in panel :

Thermoelectric
separation:

Thickness of
Immersion Gold:

Thickness of
ENEPIG:

Thickness of
ENEPIG:

Thickness of
Immersion Gold:

Thickness of
Immersion gold:

Thickness of
Hard gold:

Immersion gold /
Hard gold thickness:

Multi-level/
Step stencil:

Other Special
request:

Number of
Unique Parts:

Number of
SMD Parts:

Number of
BGA/QFP Parts:

Number of
Through-Hole
Parts:

Detailed information
of assembly: