Precision IC substrates engineered by PRS are to unleash the full potential of advanced semiconductors. Our solutions provide the essential foundation for high-performance computing, and 5G systems – enabling ultra-high-density interconnections, superior thermal management, and uncompromised signal integrity. Leveraging cutting-edge manufacturing and materials, we ensure your most innovative designs achieve optimal performance, reliability, and miniaturization.
Partner with PRS to build the future of technology from the substrate up.
| Layer |
6 |
 |
| Final Thickness |
0.29mm |
| Material |
MGC HL832NS |
| Product Type |
SIP |
| Strip Size |
240*74mm |
| Surface Finish |
Soft Au+Hard Au+OSP |
| Drill |
0.065mm |
| Copper Thickness |
15um |
| Minimum Hole Size |
18/18um |
| Business Segment |
Consumer Electronics |
| Layer |
6 |
 |
| Final Thickness |
0.23mm |
| Material |
DS-7409HGBJE(M) |
| Product Type |
LGA |
| Strip Size |
93.81*93.81mm |
| Surface Finish |
ENIG |
| Drill |
0.055mm |
| Copper Thickness |
12um |
| Minimum Hole Size |
30/40um |
| Business Segment |
Consumer Electronics |
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